The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Sep. 18, 2020
Applicants:
Honda Motor Co., Ltd., Tokyo, JP;
Tokyo Institute of Technology, Tokyo, JP;
Inventors:
Koji Sakui, Wako, JP;
Takayuki Ohba, Tokyo, JP;
Assignees:
HONDA MOTOR CO., LTD., Tokyo, JP;
TOKYO INSTITUTE OF TECHNOLOGY, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 2225/06544 (2013.01);
Abstract
A semiconductor apparatus according to an embodiment of the present invention includes: a plurality of semiconductor chips that are laminated; and a plurality of penetration electrodes that penetrate in a lamination direction through the plurality of semiconductor chips and that electrically connect together the plurality of semiconductor chips, wherein a semiconductor chip has at least one sub-memory array, and a penetration electrode penetrates through an outer circumferential part of the sub-memory array.