The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
May. 19, 2017
Applicant:
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Kosuke Ikeda, Hanno, JP;
Osamu Matsuzaki, Hanno, JP;
Assignee:
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 23/49517 (2013.01); H01L 23/49537 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/074 (2013.01); H01L 23/49562 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/404 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/73263 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract
An electronic module has a first substrate, a first electronic elementprovided on one side of the first substrate, a first connection bodyprovided on one side of the first electronic element, a second electronic elementprovided on one side of the first connection body, a second substrateprovided on one side of the second electronic element, and an abutment bodythat abuts on a face on one side of the second electronic elementand is capable of imparting a force toward one side with respect to the second substrate