The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Feb. 04, 2015
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Reiji Tsukao, Utsunomiya, JP;

Yasushi Akutsu, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B32B 5/30 (2006.01); B32B 27/06 (2006.01); B32B 3/30 (2006.01); B32B 7/04 (2019.01); B32B 27/28 (2006.01); C09J 4/00 (2006.01); B32B 7/02 (2019.01); H05K 3/32 (2006.01); C09J 163/00 (2006.01); C09J 201/00 (2006.01); B32B 7/00 (2019.01); B32B 3/00 (2006.01); B32B 27/00 (2006.01); H01R 4/04 (2006.01); B32B 27/08 (2006.01); C08L 63/00 (2006.01); C09J 7/10 (2018.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); B32B 3/00 (2013.01); B32B 3/30 (2013.01); B32B 5/30 (2013.01); B32B 7/00 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 27/00 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); C08L 63/00 (2013.01); C09J 4/00 (2013.01); C09J 7/10 (2018.01); C09J 163/00 (2013.01); C09J 201/00 (2013.01); H01L 24/29 (2013.01); H01R 4/04 (2013.01); H05K 3/323 (2013.01); B32B 2307/20 (2013.01); B32B 2307/202 (2013.01); B32B 2307/30 (2013.01); B32B 2307/302 (2013.01); B32B 2307/706 (2013.01); C08K 2201/001 (2013.01); C09J 2203/326 (2013.01); C09J 2301/204 (2020.08); C09J 2301/208 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 2224/27001 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/14 (2013.01);
Abstract

An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.


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