The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Jun. 27, 2021
Applicant:

AU Optronics Corporation, Hsinchu, TW;

Inventors:

Yu-Han Huang, Hsinchu, TW;

Chao-Chien Chiu, Hsinchu, TW;

Shih-Hua Lu, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2022.01);
U.S. Cl.
CPC ...
G06K 9/0004 (2013.01); G06K 9/00046 (2013.01);
Abstract

A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.


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