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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11306226 B1

PDFFull Text
Date of Patent:
Apr. 19, 2022

Filed:

Sep. 19, 2017

Hot melt adhesive composition and use thereof

Applicant:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Inventors:

Yuhong Hu, Belle Mead, NJ (US);

Darshak R. Desai, Edison, NJ (US);

Jinyu Chen, Fanwood, NJ (US);

Matthew L. Sharak, Franklin Park, NJ (US);

Assignee:

Henkel AG & Co. KGaA, Dusseldorf, DE;

Attorneys:

Sun Hee Lehmann

Steven C. Bauman

Primary Examiner:

John E Uselding

Int. Cl.
CPC ...
C09J 123/14 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); A61L 15/58 (2006.01); C09J 123/10 (2006.01); B32B 5/26 (2006.01); B32B 5/02 (2006.01); B32B 37/08 (2006.01); B32B 37/12 (2006.01); C09J 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 123/14 (2013.01); A61L 15/58 (2013.01); B32B 5/022 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 37/08 (2013.01); B32B 37/1207 (2013.01); C09J 5/00 (2013.01); C09J 123/10 (2013.01); B32B 2037/1215 (2013.01); B32B 2307/54 (2013.01); B32B 2307/542 (2013.01); B32B 2555/02 (2013.01); C09J 2423/10 (2013.01);
Abstract

The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable low application temperature hot melt adhesives have high green strength, excellent bond strength and aging performance. Moreover, the sprayable low application temperature hot melt adhesives allows for thin bond lines without bleed-through and burn-through risks for heat-sensitive substrates.

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