The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Jun. 28, 2021
Applicant:

Beijing Voyager Technology Co., Ltd., Beijing, CN;

Inventors:

Sae Won Lee, Mountain View, CA (US);

Qin Zhou, Mountain View, CA (US);

Youmin Wang, Mountain View, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81C 3/00 (2006.01); G02B 26/08 (2006.01); G01S 17/931 (2020.01);
U.S. Cl.
CPC ...
B81C 1/00373 (2013.01); B81C 3/004 (2013.01); G02B 26/0833 (2013.01); B81C 2201/0187 (2013.01); B81C 2203/051 (2013.01); G01S 17/931 (2020.01);
Abstract

A method comprising: adhering a first surface of a mask to a carrier substrate via a first adhesive layer; forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark; bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer; performing an alignment operation based on imaging the first alignment mark and the second alignment mark; configuring the second surface of the mask to adhere to the third surface of the wafer via the second adhesive; and disconnecting the carrier substrate from the mask.


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