The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Jul. 22, 2020
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Taichi Yonemoto, Isehara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B32B 7/12 (2013.01); B41J 2/14 (2013.01); B41J 2/14024 (2013.01); B41J 2/1433 (2013.01); B41J 2/1626 (2013.01); B41J 2/1631 (2013.01); B41J 2/1635 (2013.01); B41J 2/1642 (2013.01); B41J 2002/14419 (2013.01); B41J 2202/22 (2013.01);
Abstract

A substrate laminated body is formed by joining a first substrate for forming a part of a device and a second substrate for forming another part of the device. The first and second substrates are joined by a method comprising: a temporarily joining step of arranging an adhesive agent outside a device forming region and temporarily joining the device forming regions of the first substrate and the second substrate to be held in a non-contact state, and a finally joining step of forming a film so as to fill a gap between the device forming regions in the non-contact state and finally joining the first substrate and the second substrate by way of the film.


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