The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Jan. 12, 2018
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 25/10 (2006.01); B32B 5/02 (2006.01); B32B 25/14 (2006.01); B32B 37/24 (2006.01); A41D 19/00 (2006.01);
U.S. Cl.
CPC ...
B32B 25/10 (2013.01); A41D 19/0006 (2013.01); B32B 5/02 (2013.01); B32B 25/14 (2013.01); B32B 37/24 (2013.01); B32B 2037/243 (2013.01); B32B 2262/062 (2013.01); B32B 2270/00 (2013.01); B32B 2307/51 (2013.01); B32B 2307/546 (2013.01); B32B 2310/0418 (2013.01); B32B 2329/04 (2013.01); B32B 2333/00 (2013.01); B32B 2437/02 (2013.01); B32B 2571/00 (2013.01); Y10T 428/24967 (2015.01);
Abstract
A laminated body formed by laminating a fiber substrate composed of a plurality of fibers and a polymer layer formed from a polymer latex. The polymer layer covers the fiber substrate in a state in which a portion of the polymer layer has permeated among the fibers. A ratio (t/d) of a thickness tof the portion of the polymer layer that has permeated among the fibers (from a top surface of the fiber substrate) to a substrate layer average thickness d is 0.1 to 0.95. A thickness tof the portion of the polymer layer covering the top surface of the fiber substrate (from the top surface of the fiber substrate) is 80 μm or more.