The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Apr. 15, 2019
Applicant:

Phoenix Closures, Inc., Naperville, IL (US);

Inventor:

Jeffrey John Roddy, Oswego, IL (US);

Assignee:

PHOENIX CLOSURES, INC., Naperville, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 7/12 (2006.01); B32B 15/12 (2006.01); B65D 41/04 (2006.01); B65D 53/04 (2006.01); B65D 65/40 (2006.01); B32B 27/10 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 7/12 (2013.01); B32B 15/12 (2013.01); B32B 27/10 (2013.01); B65D 41/045 (2013.01); B65D 53/04 (2013.01); B65D 65/40 (2013.01); B32B 2435/02 (2013.01);
Abstract

The invention relates to a laminate liner for sealingly engaging a container in an associated container and closure assembly. The liner can include at least first, second, third, and fourth layers, respectively, and have a thickness between 0.0060-0.0120 inches. The first and bottom layer, can comprise a plastic polymeric material, and have a thickness between 0.0005-0.0015 inches. The second layer can comprise a metallic material and have a thickness between 0.0005-0.0010 inches. The third layer can comprise a chip board material, and have a thickness between 0.0045-0.0055 inches. The third layer can prevent the liner from curling or deforming from its preferably flat shape. The fourth and top layer can comprise a plastic polymeric material and have a thickness between 0.0005-0.0015 inches. An adhesive bonding layer, having a thickness between 0.0003-0.0005 inches, can be located between first, second, third, and fourth layers, to bond adjacent layers together.


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