The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Oct. 16, 2017
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kiyoka Takagi, Tokyo, JP;
Jun Ishida, Tokyo, JP;
Sota Kamo, Tokyo, JP;
Katsuya Yoshino, Tokyo, JP;
Tetsuya Kato, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
An adhesive injection method is for injecting an adhesive that bonds an outer plate and a reinforcing member. The reinforcing member has through holes bored through the reinforcing member in a direction intersecting a bonding surface facing the outer plate. The method includes positioning the outer plate and the reinforcing member; disposing a sealing material covering a gap between the outer plate and the reinforcing member; and injecting the adhesive into the through holes in order from one end to the other end of the bonding surface. At the injecting, while the adhesive is injected into the through hole, when the adhesive is recognized through another through hole formed adjacent to the through hole into which the adhesive is being injected, a through hole into which the adhesive is to be injected is shifted from the through hole into which the adhesive is being injected to the other through hole.