The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Mar. 04, 2020
Applicant:

Futaba Industrial Co., Ltd., Okazaki, JP;

Inventor:

Keigo Yasuda, Okazaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/00 (2006.01); F16L 3/127 (2006.01); B29L 23/00 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 65/48 (2013.01); B29C 66/5324 (2013.01); B29C 66/7212 (2013.01); B29C 66/7422 (2013.01); F16L 3/127 (2013.01); B29K 2307/04 (2013.01); B29L 2023/22 (2013.01);
Abstract

In a manufacturing method of an assembly, the assembly including a metal part and a pipe, the pipe including a material containing a resin, an adhesive is first adhered to an outer circumferential surface of the pipe and a metal part covering at least a portion of an outer circumferential surface of the pipe. Here, an area to which the adhesive is adhered on the outer circumferential surface of the pipe is defined as an adhesion area. Next, by a heat source provided inside the pipe, a target area is heated without interposing the metal part. The target area is located radially interior to the adhesion area and located on an inner circumferential surface of the pipe.


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