The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Oct. 30, 2019
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Travis L. Mayberry, Dallas, TX (US);
Craig H. McCordic, Medfield, MA (US);
Joseph R. Ellsworth, Worcester, MA (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); H01L 23/367 (2006.01); B23K 103/10 (2006.01);
U.S. Cl.
CPC ...
B23K 20/10 (2013.01); B23K 20/103 (2013.01); B23K 20/106 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); H01L 21/4871 (2013.01); H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/427 (2013.01); B23K 2103/10 (2018.08);
Abstract
A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.