The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Oct. 02, 2014
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Lea Di Cioccio, Saint Ismier, FR;

Yann Beilliard, Upie, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/18 (2006.01); B23K 20/00 (2006.01); B23K 20/24 (2006.01); B23K 31/02 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 20/002 (2013.01); B23K 20/24 (2013.01); B23K 31/02 (2013.01); H01L 21/187 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/74 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H05K 3/4611 (2013.01); B23K 2101/36 (2018.08); H01L 2224/05009 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05657 (2013.01); H01L 2224/05693 (2013.01); H01L 2224/06505 (2013.01); H01L 2224/06517 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/75754 (2013.01); H01L 2224/80035 (2013.01); H01L 2224/80097 (2013.01); H01L 2224/80136 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80906 (2013.01); H01L 2224/80935 (2013.01); H01L 2224/80948 (2013.01); H01L 2224/80986 (2013.01); H01L 2224/95 (2013.01); H01L 2225/06513 (2013.01);
Abstract

Method of assembly of a first element (I) and a second element (II) each having an assembly surface, at least one of the assembly surfaces comprising recessed metal portions () surrounded by dielectric materials () comprising: A) a step to bring the two assembly surfaces into contact without application of pressure such that direct bonding is obtained between the assembly surfaces, said first and second assemblies (I, II) forming a stack with a given thickness (e), B) a heat treatment step of said stack during which the back faces () of the first (I) and the second (II) elements are held in position so that they are held at a fixed distance (E) between the given stack thickness+/−2 nm.


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