The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Jan. 04, 2019
Applicant:

Lincoln Global, Inc., Santa Fe Springs, CA (US);

Inventors:

Andrew R. Peters, Chesterland, OH (US);

Jonathan H. Paul, Knoxville, TN (US);

Levi J. Mitchell, Windsor, CO (US);

Assignee:

LINCOLN GLOBAL, INC., Santa Fe Springs, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 9/02 (2006.01); B23K 26/342 (2014.01); B23K 9/025 (2006.01); B23K 9/028 (2006.01); B23K 9/095 (2006.01); B23K 9/12 (2006.01); B23K 37/02 (2006.01); B23K 37/04 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B23K 9/0216 (2013.01); B23K 9/025 (2013.01); B23K 9/028 (2013.01); B23K 9/0953 (2013.01); B23K 9/125 (2013.01); B23K 9/126 (2013.01); B23K 26/342 (2015.10); B23K 37/0252 (2013.01); B23K 37/04 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

Embodiments of systems and methods of additive manufacturing are disclosed. In one embodiment, a computer control apparatus accesses multiple planned build patterns corresponding to multiple build layers of a three-dimensional (3D) part to be additively manufactured. A metal deposition apparatus deposits metal material to form at least a portion of a build layer of the 3D part. The metal material is deposited as a beaded weave pattern, based on a planned path of a planned build pattern, under control of the computer control apparatus. A weave width, a weave frequency, and a weave dwell of the beaded weave pattern are dynamically adjusted during deposition of the beaded weave pattern. The adjustments are under control of the computer control apparatus based on the planned build pattern, as a width of the build layer varies along a length dimension of the build layer.


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