The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Jan. 22, 2021
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

David P. Heck, Saint Charles, MO (US);

Kevin Thomas Slattery, Saint Peters, MO (US);

David M. Milliken, Sheffield, GB;

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21J 5/02 (2006.01); B21J 13/02 (2006.01); B23P 15/24 (2006.01);
U.S. Cl.
CPC ...
B21J 5/025 (2013.01); B21J 13/02 (2013.01); B23P 15/246 (2013.01);
Abstract

Forging dies are formed from a plurality of layers stacked together to form an assembly, or laminate. Each respective layer may be cut to form a portion of a die cavity, and the layers may be stacked together such that the cut portions are aligned to form the die cavity. The layers are fastened together to form a first die half and/or a second die half of disclosed forging dies. Each layer may be selectively removable from the die half for maintenance and/or replacement. Disclosed forging dies may be formed of lower grade materials as compared to conventional forging dies, and the number and thickness of layers may be varied to accommodate the specific part geometry of the part being forged. Related methods of making said forging dies and using said forging dies to make parts are also disclosed.


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