The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Sep. 30, 2020
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Xuan Hong, Irvine, CA (US);
Daniel Maslyk, Rancho Santa Margarita, CA (US);
Qizhuo Zhuo, Irvine, CA (US);
Juliet Grace Sanchez, Carson, CA (US);
Assignee:
Henkel AG & Co. KGaA, Dusseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/78 (2006.01); H05K 9/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01); H01L 21/78 (2013.01); H01L 23/552 (2013.01); H05K 1/0218 (2013.01); H05K 9/0024 (2013.01);
Abstract
A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.