The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Dec. 15, 2017
Hewlett-packard Development Company, L.p., Spring, TX (US);
Sterling Chaffins, Corvallis, OR (US);
Kevin P. Dekam, Corvallis, OR (US);
Thomas A. Saksa, Corvallis, OR (US);
Juan Sebastian Ramirez, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.