The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Nov. 27, 2019
Applicant:

Metrospec Technology, L.l.c., Mendota Heights, MN (US);

Inventors:

Henry V. Holec, Mendota Heights, MN (US);

Wm. Todd Crandell, Minnetonka, MN (US);

Eric Henry Holec, Mendota Heights, MN (US);

Assignee:

Metrospec Technology, L.L.C., Mendota Heights, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 37/04 (2006.01); H05K 3/36 (2006.01); H01R 4/02 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01R 12/61 (2011.01); H05K 1/18 (2006.01); F21Y 115/10 (2016.01); F21Y 107/30 (2016.01);
U.S. Cl.
CPC ...
H05K 3/363 (2013.01); B23K 1/0016 (2013.01); B23K 37/04 (2013.01); B23K 37/0435 (2013.01); H01R 4/02 (2013.01); H01R 12/61 (2013.01); H05K 1/0269 (2013.01); H05K 1/118 (2013.01); H05K 1/144 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); F21Y 2107/30 (2016.08); F21Y 2115/10 (2016.08); H05K 2201/0108 (2013.01); H05K 2201/0311 (2013.01); H05K 2201/058 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/043 (2013.01); H05K 2203/16 (2013.01);
Abstract

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.


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