The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Jun. 15, 2016
Applicant:
Snaptrack, Inc., San Diego, CA (US);
Inventors:
Tomasz Jewula, Markt Schwaben, DE;
Veit Meister, Unterhaching, DE;
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/10 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02834 (2013.01); H03H 9/1064 (2013.01); H03H 9/1071 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H03H 9/145 (2013.01); H03H 9/6489 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10083 (2013.01);
Abstract
In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient α, which is substantially higher than the first thermal conductivity coefficient αof the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.