The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Nov. 20, 2020
Applicant:

Toppan Printing Co.,ltd., Tokyo, JP;

Inventors:

Tomoyuki Shirasaki, Tokyo, JP;

Hironori Nomura, Tokyo, JP;

Noriko Kanou, Tokyo, JP;

Susumu Maniwa, Tokyo, JP;

Jun Onohara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H05K 1/16 (2006.01); H03H 7/46 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0138 (2013.01); H03H 7/0115 (2013.01); H03H 7/463 (2013.01); H05K 1/165 (2013.01); H05K 3/46 (2013.01);
Abstract

A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.


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