The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Dec. 26, 2018
Boe Technology Group Co., Ltd., Beijing, CN;
Pengcheng Lu, Beijing, CN;
Xiaochuan Chen, Beijing, CN;
Shengji Yang, Beijing, CN;
Kuanta Huang, Beijing, CN;
Hui Wang, Beijing, CN;
Yanming Wang, Beijing, CN;
Weihai Wang, Beijing, CN;
Guohong Qin, Beijing, CN;
Yage Song, Beijing, CN;
Jiantong Li, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufacturing method of the via-hole connection structure includes: forming an insulation layer on a base substrate and forming a first via hole in the insulation layer; forming a connection portion in the first via hole; forming a protection layer covering the connection portion on a surface of the insulation layer; forming a second via hole in the insulation layer and in the protection layer; removing at least a portion of the protection layer to expose the connection portion.