The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Aug. 13, 2019
Applicant:

Suzhou Lekin Semiconductor Co., Ltd., Taicang, CN;

Inventors:

Min Sik Kim, Seoul, KR;

Won Jung Kim, Seoul, KR;

Ki Seok Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/382 (2013.01); H01L 33/0062 (2013.01); H01L 33/0083 (2013.01); H01L 33/504 (2013.01); H01L 33/56 (2013.01);
Abstract

A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.


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