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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11302723 B1

PDFFull Text
Date of Patent:
Apr. 12, 2022

Filed:

Jan. 17, 2018

Electrical connection method, substrate and display device

Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Dini Xie, Beijing, CN;

Wei Li, Beijing, CN;

Assignee:

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorneys:

Dilworth & Barrese, LLP.

Michael J. Musella, Esq.

Primary Examiner:

Ori Nadav

Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/768 (2006.01); G02F 1/1362 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1259 (2013.01); H01L 21/76883 (2013.01); H01L 27/124 (2013.01); G02F 1/136263 (2021.01); H01L 21/31133 (2013.01);
Abstract

A method for repairing a broken wire, a substrate and a display device are provided. The method is adopted for electrically connecting a first conductive point and a second conductive point separated from each other on a substrate. The method includes: forming a conductive polymer precursor thin film to physically connect the first conductive point and the second conductive point; and performing a polymerizing process on the conductive polymer precursor thin film to form a conductive polymer electrically connecting the first conductive point and the second conductive point.

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Xie, Dini. (2022). Electrical connection method, substrate and display device (U.S. Patent No. 11302723). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11302723

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