The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Aug. 26, 2020
Kaijo Corporation, Tokyo, JP;
Riki Jindo, Tokyo, JP;
Akio Sugito, Tokyo, JP;
KAIJO CORPORATION, Tokyo, JP;
Abstract
To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary () having a through hole through which a wire () is to be inserted; a holding unit, which is provided above the capillary (), and is configured to hold the wire () inserted through the capillary (); and a vibrating unit configured to vertically vibrate the capillary (). Under a state in which the holding unit holds the wire (), the vibrating unit vertically vibrates the capillary () so that the wire () is protruded from the leading end of the capillary.