The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Jan. 16, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chih-Chao Yang, Glenmont, NY (US);

Baozhen Li, South Burlington, VT (US);

Ashim Dutta, Menands, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 43/08 (2006.01); H01L 27/11597 (2017.01); H01L 45/00 (2006.01); H01L 43/02 (2006.01); H01L 43/12 (2006.01); H01L 27/22 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53266 (2013.01); H01L 23/5226 (2013.01); H01L 23/53261 (2013.01); H01L 27/11597 (2013.01); H01L 27/222 (2013.01); H01L 27/2481 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/12 (2013.01); H01L 45/06 (2013.01); H01L 45/122 (2013.01); H01L 45/16 (2013.01);
Abstract

Re-depositing of metal-containing particles of an embedded electrically conductive structure onto sidewalls of an overlying metal-containing structure is alleviated in the present application by providing a pedestal structure between the embedded electrically conductive structure and the metal-containing structure, wherein the pedestal structure has a flared sidewall that extends beyond a perimeter of the embedded electrically conductive structure. Such a pedestal structure (which can be referred to herein as a footing flare pedestal structure) mitigates, and in some embodiments, entirely eliminates, the exposure of the embedded electrically conductive structure during the patterning of metal-containing layers formed atop the embedded electrically conductive structure.


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