The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Dec. 22, 2019
Applicant:

Broadpak Corporation, San Jose, CA (US);

Inventor:

Farhang Yazdani, Santa Clara, CA (US);

Assignee:

BroadPak Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/36 (2006.01); H05K 3/38 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/60 (2006.01); H01L 21/66 (2006.01); H01L 21/68 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/06 (2006.01); H01L 23/28 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/488 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/473 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/3107 (2013.01); H01L 23/473 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/573 (2013.01); H01L 23/66 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/80 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/80203 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/207 (2013.01); H01L 2924/30107 (2013.01); Y10T 29/53174 (2015.01); Y10T 29/53178 (2015.01); Y10T 29/53183 (2015.01);
Abstract

An electronic package comprising a first substrate that includes a first plurality of substrate vias and one or more cavities, a second substrate that includes a second plurality of substrate vias and one or more cavities, and a standoff substrate(s). The standoff substrate(s)positioned between the first and second substrate, the standoff substrate(s) is affixed to each of the first and second substrate, standoff substrate(s) forms a clearance between the first and second substrate, the standoff substrate(s) comprises an intervening plurality of substrate vias passing through the entire thickness of the standoff substrate(s), and a portion of the second plurality of substrate vias are configured to be or capable of being electrically connected to a portion of the first plurality of substrate vias by way of a portion of the intervening plurality of substrate vias.


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