The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Aug. 21, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Shota Sato, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency moduleincludes: a circuit board; a first component, which has characteristics likely to be changed by heat, and a second component, which generates heat, that are mounted on an upper surfaceof the circuit board; a sealing resin layerconfigured to cover each of the componentsandand a component; a shield filmconfigured to cover a surface of the sealing resin layer; and a heat dissipation memberdisposed above an upper surfaceof the sealing resin layer. A recessed portionis formed in the upper surfaceof the sealing resin layeras viewed in a direction perpendicular to the upper surfaceof the circuit board. The recessed portioncan prevent the heat generated from the second componentfrom affecting the first component