The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Jul. 14, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoshitaka Matsukawa, Kyoto, JP;
Yoichi Takagi, Kyoto, JP;
Akio Katsube, Kyoto, JP;
Yoshitaka Echikawa, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An electronic component package () includes a resin layer (), an electronic component (), a grounding member (), and a conductor film (). The grounding member () includes a multilayer body () and an outer conductor () disposed at an end portion of the multilayer body () in a lamination direction. The multilayer body () includes at least one resin film () and at least one pattern conductor () laminated one on another, and at least one via conductor () extending in the lamination direction and connected to the outer conductor (). In the multilayer body (), at least one of the pattern conductor () has at least part of a circumference connected to a conductor film () and electrically connected to the via conductor (). Part of an external terminal and part of the outer conductor () are exposed from an identical surface of the resin layer ().