The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Jul. 24, 2019
Applicant:
Asti Global Inc., Taiwan, Changhua County, TW;
Inventor:
Chien-Shou Liao, New Taipei, TW;
Assignee:
ASTI GLOBAL INC., TAIWAN, Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); H01L 23/345 (2013.01); H01L 23/49816 (2013.01); H01L 24/27 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01);
Abstract
The present invention provides a chip carrier structure including: a non-circuit substrate, a plurality of micro heaters, and an adhesive layer. The micro heaters are disposed on the non-circuit substrate. The adhesive layer is disposed on the micro heaters, and a plurality of chips are disposed on the adhesive layer. Thereby, the present invention improves the solder yield of the process by a wafer carrying structure and a wafer carrying device.