The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Jul. 17, 2020
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Yosuke Nakata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/3105 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/3043 (2013.01); H01L 21/3105 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A semiconductor device manufacturing method includes processes of: applying a protective film precursor solution over an end of each of a plurality of semiconductor element structures and a side surface and a bottom surface of a groove; roughly drying a solvent in the protective film precursor solution to form a protective film; and performing full-curing to evaporate a solvent in the protective film after a process of cutting between the plurality of semiconductor element structures or a process of peeling a plurality of semiconductor elements from a dicing tape.