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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11302478 B1

PDFFull Text
Date of Patent:
Apr. 12, 2022

Filed:

Nov. 21, 2018

Multilayer ceramic capacitor

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;

Inventors:

Byung Gyun Kim, Suwon-Si, KR;

Ji Hong Jo, Suwon-Si, KR;

Jong Ho Lee, Suwon-Si, KR;

Myung Jun Park, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Arun Ramaswamy

Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/012 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01G 4/0085 (2013.01); H01G 4/1227 (2013.01);
Abstract

A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on an exterior of the body. The external electrode includes an electrode layer connected to the internal electrode and a plating portion including a nickel (Ni) plating layer, a nickel-tin (Ni—Sn) intermetallic compound layer, and a tin (Sn) plating layer, sequentially disposed on the electrode layer. The Ni—Sn intermetallic compound layer has a thickness of 0.1 μm or more.

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