The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Jul. 22, 2020
Applicant:

Composecure, Llc, Somerset, NJ (US);

Inventors:

John Herslow, Bridgewater, NJ (US);

Adam Lowe, Somerset, NJ (US);

Luis Dasilva, Bridgewater, NJ (US);

Brian Nester, Hillsborough, NJ (US);

Assignee:

Composecure, LLC, Somerset, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); H01L 23/66 (2006.01); H01Q 1/38 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07794 (2013.01); H01L 23/66 (2013.01); H01Q 1/2216 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.


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