The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

May. 17, 2019
Applicant:

Sato Holdings Corporation, Tokyo, JP;

Inventors:

Christopher A. Jones, Alsip, IL (US);

Edward J. Kmet, Riverside, IL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/00 (2006.01); B32B 7/00 (2019.01); B32B 27/00 (2006.01); B32B 37/00 (2006.01); B32B 3/00 (2006.01); B32B 38/00 (2006.01); G06K 19/077 (2006.01); B32B 7/06 (2019.01); B32B 27/10 (2006.01); B32B 7/12 (2006.01); B32B 37/06 (2006.01); B32B 3/26 (2006.01); B32B 37/14 (2006.01); B29D 30/72 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
G06K 19/0776 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/10 (2013.01); B29C 2793/0054 (2013.01); B29D 2030/726 (2013.01); B32B 3/266 (2013.01); B32B 37/06 (2013.01); B32B 37/14 (2013.01); B32B 38/0004 (2013.01); B32B 2307/732 (2013.01); B32B 2519/02 (2013.01); C09J 7/38 (2018.01); G06K 19/07754 (2013.01); Y10T 156/108 (2015.01); Y10T 156/1064 (2015.01); Y10T 156/1082 (2015.01);
Abstract

A Smart Patch comprising a label layer, an adhesive layer, a release liner layer and a RFID inlay, wherein the release liner comprises a separable inner release liner portion and a separable outer release liner portion; and the RFID inlay is adhered to a back surface of the inner release liner portion. The Smart Patches for uses including mounting to tires and other rubber materials. Methods of manufacturing including subjecting a release liner of the label to a die cut slightly larger than the size of an intended RFID inlay to form the separable inner release liner portion and outer release liner portion and applying a RFID inlay to a back surface of a release liner within the die cut inner release liner portion.


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