The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Mar. 27, 2021
Oprocessor Inc, Boston, MA (US);
Sahnggi Park, Daejeon, KR;
OPROCESSOR INC, Boston, MA (US);
Abstract
An optical module package may include a package substrate, an interposer on the package substrate, and a first semiconductor chip and a second semiconductor chip on the interposer. The interposer may include a silicon substrate having a first surface, which is adjacent to the package substrate, and a second surface, which is opposite to the first surface and adjacent to the first and second semiconductor chips, a penetration electrode penetrating the silicon substrate, a lower interconnection layer disposed on the first surface of the silicon substrate, and an optical waveguide, a first optical module, and a second optical module disposed in a lower portion of the lower interconnection layer. The first optical module may include a light source providing light into the optical waveguide, and the second optical module may include a photodetector receiving the light.