The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Nov. 24, 2017
Applicant:
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Kenichi Suzuki, Saitama, JP;
Kazuyuki Sashida, Saitama, JP;
Mizue Yamaji, Saitama, JP;
Kenichi Yoshida, Saitama, JP;
Shinji Kunori, Saitama, JP;
Assignee:
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 19/00 (2006.01); G01R 15/12 (2006.01); G01R 15/18 (2006.01);
U.S. Cl.
CPC ...
G01R 19/0092 (2013.01); G01R 15/12 (2013.01); G01R 15/181 (2013.01);
Abstract
A semiconductor componenthas a semiconductor layerincluding a winding wire partand a winding return wire partconnected at a terminal end part of the winding wire partand returning from the terminal end part toward a starting end part side, wherein the semiconductor component is disposed so as to surround an object to be measured.