The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Oct. 30, 2019
Applicant:
City University of Hong Kong, Kowloon, HK;
Inventors:
Jian Lu, Kowloon, HK;
Yang Yang Li, Kowloon, HK;
Weihui Ou, Kowloon, HK;
Binbin Zhou, Kowloon, HK;
Junda Shen, Kowloon, HK;
Chenghao Zhao, Kowloon, HK;
Assignee:
City University of Hong Kong, Kowloon, HK;
Primary Examiner:
Int. Cl.
CPC ...
C25D 11/02 (2006.01); C25D 5/00 (2006.01); C25D 5/18 (2006.01); C25D 5/34 (2006.01);
U.S. Cl.
CPC ...
C25D 11/024 (2013.01); C25D 5/18 (2013.01); C25D 5/34 (2013.01); C25D 5/605 (2020.08);
Abstract
A method for treating a surface of a metallic structure, the metallic structure being made of a first metallic material, the method including the steps of: (a) releasing metallic ions from the surface of the metallic structure; and (b) depositing a nano-structured metallic layer onto the surface of the metallic structure from the released metallic ions, wherein the nano-structured metallic layer includes uniform nanoparticles.