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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11299448 B1

PDFFull Text
Date of Patent:
Apr. 12, 2022

Filed:

Apr. 10, 2018

Active ester compound

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Tatsuya Okamoto, Ichihara, JP;

Yutaka Satou, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Sudhakar Katakam

Assistant Examiner:

Jennifer C Sawyer

Int. Cl.
CPC ...
C07C 65/21 (2006.01); C07C 67/03 (2006.01); C08L 27/12 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01); C08K 5/10 (2006.01);
U.S. Cl.
CPC ...
C07C 65/21 (2013.01); C07C 67/03 (2013.01); C08L 27/12 (2013.01); H01L 23/29 (2013.01); H05K 1/03 (2013.01); C08K 5/10 (2013.01);
Abstract

An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

Find Patent Forward Citations

Okamoto, Tatsuya. (2022). Active ester compound (U.S. Patent No. 11299448). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11299448

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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