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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11298866 B1

PDFFull Text
Date of Patent:
Apr. 12, 2022

Filed:

Mar. 11, 2016

Liquid blow molding apparatus and liquid blow molding method

Applicant:

Discma Ag, Hunenberg, CH;

Inventors:

Kenichi Suyama, Kanagawa, JP;

Yuichi Okuyama, Kanagawa, JP;

Assignee:

Discma AG, Zürich, CH;

Attorneys:

Eric J. Sosenko

Jonathan P. O'Brien

Honigman LLP

Primary Examiner:

Monica A Huson

Int. Cl.
CPC ...
B29C 49/06 (2006.01); B29C 49/46 (2006.01); B65D 1/00 (2006.01); B29C 49/58 (2006.01); B29L 31/00 (2006.01); B29C 49/02 (2006.01); B65D 1/02 (2006.01);
U.S. Cl.
CPC ...
B29C 49/06 (2013.01); B29C 49/46 (2013.01); B29C 49/58 (2013.01); B65D 1/00 (2013.01); B29C 2049/024 (2013.01); B29C 2049/4602 (2013.01); B29C 2049/4664 (2013.01); B29C 2049/5803 (2013.01); B29L 2031/712 (2013.01); B29L 2031/7158 (2013.01); B65D 1/0207 (2013.01);
Abstract

A liquid-blow molding apparatus including a blow-molding mold that houses a preform leaving a mouth that serves as an open end thereof; a blow nozzle that supplies a pressurized liquid into the preform; a partition-wall member that closely surrounds a periphery of an outer-wall surface of the mouth of the preform and defines a mouth-external pressurized space with the outer-wall surface; and pressurized liquid-supply means for supplying a pressurized liquid into the mouth-external pressurized space so that pressure in the mouth-external pressurized space is higher than pressure inside the preform during liquid blow-molding.

Find Patent Forward Citations

Suyama, Kenichi. (2022). Liquid blow molding apparatus and liquid blow molding method (U.S. Patent No. 11298866). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11298866

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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