The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Jan. 24, 2019
Applicants:

Ihi Corporation, Koto-ku, JP;

University Public Corporation Osaka, Osaka, JP;

Inventors:

Yoshiyuki Iso, Tokyo, JP;

Ryosuke Ikeda, Tokyo, JP;

Shiko Nakamura, Tokyo, JP;

Kenji Katoh, Osaka, JP;

Tatsuro Wakimoto, Osaka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 19/32 (2006.01); B01D 47/14 (2006.01); B01J 10/00 (2006.01); B01J 19/24 (2006.01);
U.S. Cl.
CPC ...
B01D 47/14 (2013.01); B01J 10/00 (2013.01); B01J 19/247 (2013.01); B01J 19/32 (2013.01); B01J 2219/328 (2013.01); B01J 2219/3221 (2013.01); B01J 2219/32206 (2013.01); B01J 2219/32234 (2013.01); B01J 2219/32408 (2013.01);
Abstract

The packing has one or more thin-layer packing elements that are installed upright, the packing element having a main body portion with a planar liquid film formation surface, and one or more wall portions that are provided upright relative to the liquid film formation surface along a linear direction. The side surface of each wall portion has a curved portion at the base thereof connected to the liquid film formation surface, the curved portion curving so as to continue into the liquid film formation surface.


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