The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Jun. 28, 2018
Applicants:

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Fu-Yun Shen, Huai an, CN;

Ming-Jaan Ho, New Taipei, TW;

Hsiao-Ting Hsu, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); C09J 9/02 (2006.01); C09J 163/00 (2006.01); B32B 7/12 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01); B32B 7/12 (2013.01); B32B 27/281 (2013.01); C09J 9/02 (2013.01); C09J 163/00 (2013.01); H05K 1/0218 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2307/212 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08L 2205/025 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/035 (2013.01); H05K 2201/0715 (2013.01);
Abstract

A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place.


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