The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Jul. 02, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Yuta Morimoto, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency module () includes a multilayer wiring substrate (), a plurality of components () mounted on an upper surface () of the multilayer wiring substrate (), a sealing resin layer () laminated on the upper surface () of the multilayer wiring substrate () and sealing the plurality of components (), and a shield (). The shield () is composed of shield walls () arranged in grooves () and (), respectively, formed between the first component () and the second component () in the sealing resin layer () and a connecting conductor () coupling both the shield walls (). A first region () and a second region () in the sealing resin layer () split by the shield () are contiguous at the location of the connecting conductor () as seen from a direction perpendicular to the upper surface () of the multilayer wiring substrate ().