The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Oct. 30, 2020
Applicants:

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Inventors:

Zhi Guo, Shenzhen, CN;

Chao-Feng Huang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/20 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/24 (2006.01); H01L 23/40 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
H05K 3/462 (2013.01); H05K 1/115 (2013.01); H05K 3/4053 (2013.01); H05K 3/4626 (2013.01); H05K 2201/09518 (2013.01); H05K 2201/09727 (2013.01); H05K 2203/0278 (2013.01);
Abstract

A multi-layered circuit board proofed against conductor loss or diminution when heated includes first and second circuit base boards. Each first circuit base board includes a first dielectric layer and a first wiring layer formed thereon and a first stepped paste block as a conductor formed in the first dielectric layer. The first stepped paste block is electrically connected to the first dielectric layer. Each second circuit base board includes a second dielectric layer and a second wiring layer, a second stepped paste block as a conductor is formed in the second dielectric layer. When pressed together for an electrical interconnection, the paste blocks are sealed and thus captive between the first and second circuit base boards.


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Guo, Zhi. (2022). Multi-layered circuit board (U.S. Patent No. 11297722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11297722

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