The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Apr. 21, 2021
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Yun Mi Bae, Seoul, KR;
Soon Gyu Kwon, Seoul, KR;
Sang Hwa Kim, Seoul, KR;
Sang Young Lee, Seoul, KR;
Jin Hak Lee, Seoul, KR;
Han Su Lee, Seoul, KR;
Dong Hun Jeong, Seoul, KR;
In Ho Jeong, Seoul, KR;
Dae Young Choi, Seoul, KR;
Jung Ho Hwang, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/24 (2006.01); H05K 3/18 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); C25D 3/48 (2006.01); C25D 5/02 (2006.01); C25D 5/48 (2006.01); C25D 7/12 (2006.01); H05K 1/11 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/244 (2013.01); C25D 3/48 (2013.01); C25D 5/022 (2013.01); C25D 5/48 (2013.01); C25D 7/123 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 3/108 (2013.01); H05K 3/181 (2013.01); H05K 3/188 (2013.01); C25D 3/38 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/098 (2013.01); H05K 2201/099 (2013.01); H05K 2201/0989 (2013.01); H05K 2203/1184 (2013.01);
Abstract
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.