The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Oct. 05, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Yusuke Naniwa, Nagaokakyo, JP;
Hideki Muto, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/10 (2006.01); H04B 1/48 (2006.01); H04B 1/38 (2015.01); H04B 1/00 (2006.01);
U.S. Cl.
CPC ...
H04B 1/1027 (2013.01); H04B 1/00 (2013.01); H04B 1/006 (2013.01); H04B 1/10 (2013.01); H04B 1/1018 (2013.01); H04B 1/38 (2013.01); H04B 1/48 (2013.01);
Abstract
An RF module includes a switch IC on a surface of a module substrate and a passive circuit provided in and/or on the module substrate. The switch IC includes a high-frequency circuit on an IC substrate and a digital control circuit. In a plan view of the IC substrate, the digital control circuit is surrounded by the high-frequency circuit. The high-frequency circuit includes analog ground electrodes in a boundary portion with the digital control circuit in the high-frequency circuit to surround the digital control circuit in the plan view.