The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Apr. 22, 2021
Huawei Technologies Co., Ltd., Shenzhen, CN;
Jari Kristian Van Wonterghem, Kista, SE;
Alexander Khripkov, Helsinki, FI;
Dong Liu, Helsinki, FI;
Janne Ilvonen, Helsinki, FI;
Jian Ou, Kista, SE;
Ruiyuan Tian, Helsinki, FI;
Changnian Xu, Shenzhen, CN;
Wei Huang, Shenzhen, CN;
Zlatoljub Milosavljevic, Helsinki, FI;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
A millimeter-wave (mmWave) assembly () comprising a first mmWave module (), a second mmWave module (), and a connector () configured to releasably interconnect the first mmWave module () and the second mmWave module (). The connector () comprises a first connector element () associated with the first mmWave module (). The first mmWave module () comprises a first substrate () and an mmWave radio frequency integrated circuit (RFIC) (), and the second mmWave module () comprises a second substrate () and an mmWave antenna array (). The connector () is configured to transmit at least one signal between the mmWave RFIC () and the mmWave antenna array () when the first mmWave module () and the second mmWave module () are interconnected.