The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Oct. 16, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Myeong Woo Han, Suwon-si, KR;

Ju Hyoung Park, Suwon-si, KR;

Dae Ki Lim, Suwon-si, KR;

Jeong Ki Ryoo, Suwon-si, KR;

Won Cheol Lee, Suwon-si, KR;

Nam Ki Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); H01Q 1/22 (2006.01); H01Q 5/35 (2015.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0025 (2013.01); H01Q 1/2283 (2013.01); H01Q 5/35 (2015.01); H01Q 21/065 (2013.01); H01Q 21/067 (2013.01);
Abstract

An antenna module includes: an IC package including an IC; first and second antenna portions including respective patch antenna patterns, respective feed vias connected to the respective patch antenna patterns, and respective dielectric layers surrounding the respective feed vias; and a connection member having an upper surface on which the first and second antenna portions are disposed and a lower surface on which the IC package is disposed, the connection member forming an electrical connection path between the IC and the feed via of the first antenna portion and an electrical connection path of the second antenna portion. The connection member includes a first region disposed between the IC package and the first antenna portion, a second region on which the second antenna portion is disposed, and a third region electrically connecting the first and second regions and being more flexible than the dielectric layer of the first antenna portion.


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