The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Nov. 29, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Joo Young Kim, Hwaseong-si, KR;

Byong Gwon Song, Seoul, KR;

Jeong Il Park, Seongnam-si, KR;

Jiyoung Jung, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/10 (2006.01); H01L 27/28 (2006.01); H01L 21/84 (2006.01); H01L 51/05 (2006.01); H01L 51/00 (2006.01); H01L 29/423 (2006.01); H01L 51/40 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0516 (2013.01); H01L 27/283 (2013.01); H01L 29/42384 (2013.01); H01L 51/0018 (2013.01); H01L 51/0074 (2013.01); H01L 51/0545 (2013.01); H01L 51/0558 (2013.01); H01L 51/0566 (2013.01); H01L 51/105 (2013.01);
Abstract

A thin film transistor includes a gate electrode, a semiconductor layer overlapped with the gate electrode, a gate insulating layer between the gate electrode and the semiconductor layer, and a source electrode and a drain electrode electrically connected to the semiconductor layer. The semiconductor layer includes a plurality of holes. The gate insulating layer may include a plurality of recess portions at a surface of the gate insulating layer facing the semiconductor layer. A method of manufacturing the thin film transistor is provided. A thin film transistor array panel and an electronic device may include the thin film transistor.


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