The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Mar. 20, 2020
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Ali Sengül, Zurich, CH;

Oscar Torrents Abad, Cork, IE;

Daniel Brodoceanu, Cork, IE;

Zheng Sung Chio, Cork, IE;

Jeb Wu, Redmond, WA (US);

Chao Kai Tung, Cork, IE;

Tennyson Nquty, Cork, IE;

Allan Pourchet, Cork, IE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01F 7/02 (2006.01); H01L 33/32 (2010.01); H01L 33/06 (2010.01); H01L 33/14 (2010.01); G02B 27/01 (2006.01); H01L 33/24 (2010.01); F21V 8/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01F 7/0252 (2013.01); G02B 6/0068 (2013.01); G02B 6/0073 (2013.01); G02B 27/0172 (2013.01); G02B 2027/0112 (2013.01); G02B 2027/0178 (2013.01); H01L 33/06 (2013.01); H01L 33/145 (2013.01); H01L 33/24 (2013.01); H01L 33/32 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via magnetized interconnects. The backplane substrate may include circuits for driving the LED array, and each of the magnetized interconnects electrically connect a LED device to a corresponding circuit of the backplane substrate. The magnetized interconnects may be formed by electrically connecting first structures protruding from the backplane substrate to second structures protruding from the LED substrate. At least one of the first structure and the second structure includes ferromagnetic material configured to secure the first structure to the second structure.


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