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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11296245 B1

PDFFull Text
Date of Patent:
Apr. 05, 2022

Filed:

Dec. 11, 2019

Image capturing apparatus including a compound semiconductor layer

Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Shiro Uchida, Tokyo, JP;

Hideshi Abe, Kanagawa, JP;

Tomomasa Watanabe, Kanagawa, JP;

Hiroshi Yoshida, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:

K&L Gates LLP

Primary Examiner:

Nduka E Ojeh

Assistant Examiner:

Laura M Dykes

Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/0224 (2006.01); H01L 31/105 (2006.01); H01L 27/144 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022475 (2013.01); H01L 27/1443 (2013.01); H01L 27/1446 (2013.01); H01L 27/14634 (2013.01); H01L 31/022466 (2013.01); H01L 31/105 (2013.01); H01L 27/1462 (2013.01); H01L 27/14627 (2013.01); H01L 27/14694 (2013.01);
Abstract

A light receiving element includes a surface recombination prevention layer composed of a first compound semiconductor on which light is incident; a photoelectric conversion layer composed of a second compound semiconductor; and a compound semiconductor layer composed of a third compound semiconductor, the surface recombination prevention layer having a thickness of 30 nm or less. Also, there are provided an image capturing element including the light receiving element, and an image capturing apparatus including the image capturing element.

Find Patent Forward Citations

Uchida, Shiro. (2022). Image capturing apparatus including a compound semiconductor layer (U.S. Patent No. 11296245). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11296245

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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