The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Jun. 19, 2018
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventor:
Kazuyuki Tomida, Kanagawa, JP;
Assignee:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/113 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 21/28 (2013.01); H01L 29/417 (2013.01);
Abstract
[Object] To stably form a low-resistance electrical coupling between a metal and a semiconductor. [Solution] An electrical coupling structure includes: a semiconductor layer; a metal layer; and an intermediate layer that is held between the semiconductor layer and the metal layer, and includes an insulating layer provided on the semiconductor layer side and a two-dimensional material layer provided on the metal layer side.